Micro Pin-Fin Heat Sink: Multiphysics Cooling
What I did
Developed a coupled 3D flow and heat-transfer model of a micro pin-fin heat sink for high-heat-flux microprocessor hotspots. Compared inlet velocity, fin diameter and spacing, while assessing temperature, pressure drop and pumping power.
Key findings
A 1.2 m/s inlet velocity and 100 µm pin gap offered the best reported compromise between hotspot cooling and pumping requirements.